MRC | Criteria | Characteristic |
---|---|---|
CSSL | Design Function And Quantity | 4 BUFFER |
ADAU | Body Height | 0.100 INCHES MAXIMUM |
PRMT | Precious Material | GOLD |
CQSJ | Inclosure Material | GLASS |
CBBL | Features Provided | HERMETICALLY SEALED AND |
CQZP | Input Circuit Pattern | QUAD 1 INPUT |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
ADAT | Body Width | 0.240 INCHES MINIMUM AND |
ADAT | Body Width | 0.260 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | GOLD |
PMLC | Precious Material And Location | TERMINAL SURFACE GOLD |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
CBBL | Features Provided | MONOLITHIC AND |
MRC | Decoded Requirement | Clear Text Reply |
CBBL | Features Provided | POSITIVE OUTPUTS AND |
ADAQ | Body Length | 0.745 INCHES MINIMUM AND |
CBBL | Features Provided | TRUE/COMPLEMENTARY |
ADAQ | Body Length | 0.770 INCHES MAXIMUM |
CZEN | Voltage Rating And Type Per Characteristic | 20.0 VOLTS MAXIMUM POWER SOURCE |
TTQY | Terminal Type And Quantity | 14 PRINTED CIRCUIT |
AEHX | Maximum Power Dissipation Rating | 500.0 MILLIWATTS |
CQSJ | Inclosure Material | CERAMIC AND |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CQWX | Output Logic Form | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
ADAU | Body Height | 0.095 INCHES MINIMUM AND |
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