MRC | Criteria | Characteristic |
---|---|---|
AAQL | BODY STYLE | CHIP TYPE |
AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL |
ADAQ | BODY LENGTH | 0.110 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.110 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.058 INCHES MINIMUM AND 0.102 INCHES MAXIMUM |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
CQBQ | CAPACITANCE VALUE PER SECTION | 0.300 PICOFARADS SINGLE SECTION |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
CQLZ | III TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 90.0 SINGLE SECTION |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 500.0 DC SINGLE SECTION |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -20.0/+20.0 SINGLE SECTION |
CRTP | TOLERANCE RANGE PER SECTION | -0.10/+0.10 PICOFARADS SINGLE SECTION |
CWJK | CASE MATERIAL | CERAMIC |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
CWQF | QUALITY FACTOR AT REFERENCE TEMP | 100.000 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
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